Aptiv PLC, a prominent Swiss technology firm, alongside its American subsidiary Winchester Interconnect, has unveiled an innovative modular connector specifically designed for use in satellites and unmanned aerial systems. The newly developed connector, named Modulus, is engineered to facilitate the transmission of signals, data, and power between various terminals and devices.
This cutting-edge solution combines high-speed single-pair Ethernet with configurable power options within a compact design that is also field-serviceable. This feature empowers users to optimize their development processes and maintain equipment with greater ease and efficiency.
In addition to its core functionalities, Modulus is equipped with a standardized interface, ensuring durability and reliability in complex operational environments. These attributes make it particularly well-suited for low-earth orbit satellite constellations and tactical drone missions, where performance and resilience are paramount.
Joseph Massaro, vice chair and president of Engineered Components at Aptiv, emphasized the significance of this product for engineering teams. He stated, “Modulus provides engineers with the configurability they need in one platform…while maintaining the ruggedness demanded by space and defense applications.” The modular design allows for mixing and matching of components, as well as field replacement, which further ensures rapid maintenance and minimal downtime.
The consortium highlighted that Modulus addresses the increasing demands for smaller sizes, reduced weights, and lower power consumption found in defense programs, all while ensuring high performance levels. By merging Aptiv’s reliable connector technology with the expertise of Winchester, Modulus is anticipated to be a versatile tool that adapts to dynamic requirements, eliminating the necessity for complete redesigns of connectors.
Clint Schlosser, senior product manager at Winchester Interconnect, acknowledged the complexities involved in creating a truly modular architecture. He pointed out the challenge of maintaining signal integrity alongside power performance within a compact form factor. Schlosser noted that “each module carries stringent high-speed data requirements while sitting next to power and signal contacts in a small footprint.” He concluded that Modulus effectively addresses these challenges through features such as controlled impedance, optimized contact geometry, and ruggedized materials.
